The TDA1011 is a monolithic integrated audio
amplifier circuit in a 9-lead single in-line (SIL) plastic package. The device is especially designed for portable radio and recorder applications and delivers up to 4 W in a 4 W load impedance.
The device can deliver up to 6 W into 4 W at 16 V loaded supply in mains-fed applications. The maximum permissible supply voltage of 24 V makes this circuit very suitable for d.c. and a.c. apparatus, while the very low applicable supply voltage
of 3,6 V permits 6 V applications. Special features are:
Circuit Amplifier TDA1011
single in-line (SIL) construction for easy mounting, separated preamplifier and power
amplifier, high output power, thermal protection, high input impedance, low current drain, limited noise behaviour at radio frequencies.
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these situations reflow soldering is often used.
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the
temperature within the permissible limit.